| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a film adhesive for circuit connection having high connection reliability, slight in uneven areas, and capable of satisfying both low-temperature-and-short-time curability and storage stability. <P>SOLUTION: A method for producing the film adhesive for circuit connection includes: the step of preparing a binder solution by dissolving a first thermosetting resin in a solvent followed by dissolving a film-forming polymer in the solvent under such a condition that the maximum temperature is 50°C or higher to prepare the binder solution where the first thermosetting resin and the film-forming polymer are dissolved in the solvent; the step of preparing a coating liquid by mixing at 40°C or lower the binder solution with a dispersion made by dispersing microcapsule-type curing agent in a second thermosetting resin beforehand to prepare the coating solution where the microcapsule-type curing agent is dispersed in the binder solution; and the film-forming step of coating a releasable substrate with the coating solution followed by volatilizing the solvent. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
