Integrated circuit comprising a device with a vertical mobile element integrated in a support substrate and method for producing the device with a mobile element

摘要

The integrated circuit comprises a support substrate having opposite first and second main surfaces. A cavity passes through the support substrate and connects the first and second main surfaces. The integrated circuit comprises a device with a mobile element, the mobile element and a pair of associated electrodes of which are included in a cavity. An anchoring node of the mobile element is located at the level of the first main surface. The integrated circuit comprises a first elementary chip arranged at the level of the first main surface and electrically connected to the device with a mobile element.

主权项

1. An integrated circuit comprising:
a support substrate provided with opposite first and second main surfaces, a cavity passing through the support substrate from one of the main surface to the opposite main surface, a device with a mobile element formed in said support substrate, wherein the mobile element is included in the cavity, the mobile element having a first anchoring node on the first main surface, a second anchoring node on the second main surface, and a maximum displacement area, the first and second anchoring nodes and the maximum displacement area defining an axis substantially perpendicular to the first and second main surfaces, at least one elementary chip arranged on one of the main surfaces and adapted to be electrically linked to the device with a mobile element.