| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a failure occurrence process analysis device and an analysis method for failure occurrence process that can speedily and accurately estimate and specify a defect occurrence process.SOLUTION: A failure occurrence process analysis device includes: a mapping section (521) which maps final defect information obtained in a final inspection process on coordinates set on a member for each defect kind; a linking section (522) which links intermediate defect information obtained in an intermediate inspection process to correction result information obtained after a correction process for a defect detected in the intermediate inspection process; and a classification mapping section (524) which maps the intermediate defect information on coordinates set on the member by classifications of correction result information based upon classification results of the intermediate defect information by a classification section (523).</p> |
