| 摘要 |
PROBLEM TO BE SOLVED: To suppress the decrease in temperature during transportation of a substrate.SOLUTION: There is provided a resin sealing device 100 provided with a transport device 124 for transporting a substrate 102, wherein the transport device 124 is provided with a heat insulating plate 148 capable of suppressing radiation of heat from the substrate 102 in transporting the substrate 102. The heat insulating plate 148 is provided with a heat reflecting plate 150 having a function of reflecting heat radiated from the substrate 102 on a surface facing the substrate 102 of the heat insulating plate 148. Further, there is provided a preliminary heating part 114 for preliminarily heating the substrate 102 before carrying in molds 118 and 120 for resin sealing the substrate 102. |
