| 摘要 |
A printed circuit board (11) comprising conductive layers separated by insulation layers of dielectric material, at least one conductive layer (13) being patterned and having at least one signal line (14, 15) embedded in insulation material. The at least one signal line (14, 15) is covered by a dielectric film (20), followed by a thin conductive layer (21), whereby the dielectric film covers at least one surface (14s, 15s) and both sides (14a, 14b; 15a, 15b) of the at least one signal line and the thin conductive layer (21) extends, separated by the dielectric film, over the at least one surface of the signal line and at least partially over the height (h) of both sides of the signal line. |
