发明名称
摘要 The present invention provides a multilayer rigid flexible printed circuit board including: a flexible region including a flexible film having a circuit pattern formed on one or both surfaces thereof and a laser blocking layer formed on the circuit pattern; and a rigid region formed adjacent to the flexible region and including a plurality of pattern layers on one or both surfaces of extended portions extended to both sides of the flexible film of the flexible region, and a method for manufacturing the same.
申请公布号 JP5529239(B2) 申请公布日期 2014.06.25
申请号 JP20120250926 申请日期 2012.11.15
申请人 发明人
分类号 H05K3/46;H05K3/00 主分类号 H05K3/46
代理机构 代理人
主权项
地址