发明名称 Substrate treating apparatus and substrate treating method
摘要 PURPOSE: A substrate processing device and a method are provided to form a particle size of a hydrophobic solution as a micrometer or a nanometer. CONSTITUTION: A substrate processing device (10) includes a chamber (100), a support member (200), a nozzle unit (300), and a voltage source (400). The chamber forms an internal space. The support member is provided to the internal space. A substrate is located on an upper side of the support member. The nozzle unit sprays a film forming solution on an upper side of the substrate. The voltage source connects one end to the nozzle unit and generates the potential difference between the nozzle unit and the support member.
申请公布号 KR101408784(B1) 申请公布日期 2014.06.18
申请号 KR20120069379 申请日期 2012.06.27
申请人 发明人
分类号 B05B13/00;G02B26/00 主分类号 B05B13/00
代理机构 代理人
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