Electronic packaging with a variable thickness mold cap

摘要

An electronic package with improved warpage compensation. The electronic package includes a mold cap having a variable thickness. The variable thickness can have a mound or dimple design. In another embodiment, a method is provided for reducing unit warpage of an electronic package by designing the topography of a mold cap to compensate for warpage.

主权项

1. A method of reducing unit warpage of an electronic package having a substrate, comprising:
placing an overmold having a plurality of heights over the electronic package, the electronic package comprising a plurality of components formed on a substrate, wherein the plurality of heights are selected to reduce either positive/convex direction or negative/concave direction warpage of each of the plurality of components; applying a molding compound between the substrate and the plurality of components of the electronic package and the overmold; and reducing unit warpage by allowing the molding compound to form a mold cap having a plurality of thicknesses.