IMAGE SENSOR PACKAGE

摘要

An image sensor package including a PCB including bonding areas, an image sensor including bonding pads on edge portions thereof on the PCB, bonding wires connecting the bonding pads with the bonding areas, an insulating adhesion film attaching the bonding wires to the bonding pads on the edge portions of the image sensor, a heat spread pattern spaced apart from the bonding wires and the image sensor on the insulating adhesion film, a supporting holder spaced apart from the edge portions of the image sensor, encloses the image sensor, contacts a top surface of the heat spread pattern and the PCB, and includes a supporting portion at an upper portion thereof, and a transparent cover covering the image sensor on the supporting portion of the supporting holder and spaced apart from the top surface of the image sensor is provided.

主权项

1. An image sensor package, comprising:
a printed circuit board (PCB) including bonding areas; an image sensor on the PCB, the image sensor including bonding pads on edge portions thereof; bonding wires configured to connect the bonding pads with the bonding areas; an insulating adhesion film on the edge portions of the image sensor, the insulating adhesion film configured to attach the bonding wires to the bonding pads; a heat spread pattern on the insulating adhesion film, the heat spread pattern spaced apart from the bonding wires and the image sensor; a supporting holder configured to enclose the image sensor and spaced apart from the edge portions of the image sensor, the supporting holder configured to contact a top surface of the heat spread pattern and the PCB, and the supporting holder including a supporting portion at an upper portion thereof; and a transparent cover configured to cover the image sensor, the transparent cover on the supporting portion of the supporting holder and spaced apart from a top surface of the image sensor.