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发明名称
半导体装置之制造方法，基板处理方法及基板处理装置
摘要
申请公布号
TWI441259
申请公布日期
2014.06.11
申请号
TW100111962
申请日期
2011.04.07
申请人
日立国际电气股份有限公司 日本
发明人
广濑义朗;金山健司;水野谦和;高泽裕真;太田阳介
分类号
H01L21/318
主分类号
H01L21/318
代理机构
代理人
赖经臣 台北市松山区南京东路3段346号11楼;宿希成 台北市松山区南京东路3段346号11楼
主权项
地址
日本
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