Full tape thickness feature conductors for EMI structures

摘要

Generally annular full tape thickness conductors are formed in single or multiple tape layers, and then stacked to produce an annular solid conductive wall for enclosing an electromagnetic isolation cavity. The conductors may be formed using punch and fill operations, or by flowing conductor-containing material onto the tape edge surfaces that define the interior sidewalls of the cavity.

主权项

1. A method for making a full tape thickness conductor in a plurality of dielectric tape layers, comprising:
removing dielectric material to form a first slot through the thickness of a first said tape layer; filling the first slot with material comprising the conductor; drying the material in the first slot; removing dielectric material to form a second slot through the thickness of a second said tape layer; filling the second slot with material comprising the conductor; drying the material in the second slot; stacking said first and second tape layers to form a tape stack with said first and second slots in overlapping relationship to one another; removing dielectric material to form through the first and second tape layers, as already stacked in said tape stack, a third slot that contacts said first and second slots; filling the third slot with material comprising the conductor; and drying the material in the third slot.