发明名称 Power module
摘要 A power module includes a power module board including an insulating layer and a conductive circuit formed on the insulating layer, a power device provided on the power module board and electrically connected to the conductive circuit, and a thermal conductive sheet for dissipating the heat generated from the power module board and/or the power device. The thermal conductive sheet contains a plate-like boron nitride particle and the thermal conductivity in a direction perpendicular to the thickness direction of the thermal conductive sheet is 4 W/m·K or more.
申请公布号 US8749978(B2) 申请公布日期 2014.06.10
申请号 US201113016521 申请日期 2011.01.28
申请人 Nitto Denko Corporation 发明人 Izutani Seiji;Uchiyama Hisae;Fukuoka Takahiro;Hara Kazutaka
分类号 H05K7/20 主分类号 H05K7/20
代理机构 代理人
主权项 1. A power module comprising: a power module board comprising an insulating layer and a conductive circuit formed on the insulating layer; a power device provided on the power module board and electrically connected to the conductive circuit; and a thermal conductive sheet for dissipating the heat generated from the power module board and/or the power device; wherein the thermal conductive sheet contains a particle consisting of a plate-like boron nitride particle; and the thermal conductivity in a direction perpendicular to the thickness direction of the thermal conductive sheet is 4 W/m·K or more, a longitudinal direction of the boron nitride particle oriented along a surface direction that is perpendicular to the thickness direction of the thermal conductive sheet, and the thermal conductive sheet is interposed between the insulating layer of the power module board and the power device, and the conductive circuit is formed on the insulating layer so as not to overlap the thermal conductive sheet when projected in the thickness direction.
地址 Osaka JP