METHOD OF BONDING SUBSTRATES, METHOD OF MANUFACTURING ENCAPSULATION BODY, AND METHOD OF MANUFACTURING LIGHT-EMITTING DEVICE

摘要

PROBLEM TO BE SOLVED: To improve productivity related to an irradiation step of laser light in a bonding technology for substrates using glass frit, and to provide an encapsulation body or a light-emitting device with a high airtightness that can be manufacture with high productivity.SOLUTION: When a glass layer that is a melted body obtained by melting a glass frit or a sintered body obtained by sintering a glass frit is irradiated with laser light and heated, for the purpose of enhancing the heating efficiency compared with the conventional art, a material absorbing the laser light is adhered to the glass layer so as to be contacted with an upper surface of the glass layer and to expose a part of the upper surface, and then, laser light is emitted in a state that the part of the upper surface of the glass layer is contacted with a bonding surface of a substrate.