发明名称 HEAT-CONDUCTING FOAM SHEET FOR ELECTRONIC INSTRUMENTS AND HEAT-CONDUCTING LAMINATE FOR ELECTRONIC INSTRUMENTS
摘要 Provided is a heat-conducting foam sheet for electronic instruments, the sheet having a thinness and flexibility that allow the sheet to be used suitably inside electronic instruments and having excellent thermal conductivity. A heat-conducting foam sheet for electronic instruments in which heat conductors are contained in the elastomer resin portions configuring the foam sheet, wherein: the content of said heat conductors with respect to 100 parts by mass of the elastomer resin is 100 - 500 parts by mass; the 25% compression strength of the foam sheet is 200 kPa or less; and thickness is 0.05 - 1 mm.
申请公布号 WO2014083890(A1) 申请公布日期 2014.06.05
申请号 WO2013JP71287 申请日期 2013.08.06
申请人 SEKISUI CHEMICAL CO., LTD. 发明人 KATO, TETSUHIRO;SHIMONISHI, KOJI;KURINO, YUKINORI
分类号 C08J9/04;C08K3/00;C08L101/00 主分类号 C08J9/04
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