发明名称 |
HEAT-CONDUCTING FOAM SHEET FOR ELECTRONIC INSTRUMENTS AND HEAT-CONDUCTING LAMINATE FOR ELECTRONIC INSTRUMENTS |
摘要 |
Provided is a heat-conducting foam sheet for electronic instruments, the sheet having a thinness and flexibility that allow the sheet to be used suitably inside electronic instruments and having excellent thermal conductivity. A heat-conducting foam sheet for electronic instruments in which heat conductors are contained in the elastomer resin portions configuring the foam sheet, wherein: the content of said heat conductors with respect to 100 parts by mass of the elastomer resin is 100 - 500 parts by mass; the 25% compression strength of the foam sheet is 200 kPa or less; and thickness is 0.05 - 1 mm. |
申请公布号 |
WO2014083890(A1) |
申请公布日期 |
2014.06.05 |
申请号 |
WO2013JP71287 |
申请日期 |
2013.08.06 |
申请人 |
SEKISUI CHEMICAL CO., LTD. |
发明人 |
KATO, TETSUHIRO;SHIMONISHI, KOJI;KURINO, YUKINORI |
分类号 |
C08J9/04;C08K3/00;C08L101/00 |
主分类号 |
C08J9/04 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|