| 摘要 |
<p>To provide a multilayer wiring board that ensures sufficient close contact strength between a conformal type conductor and a resin insulating layer. A multilayer wiring board includes a multilayered construction where a plurality of resin insulating layers and a plurality of conductor layers are alternately layered. In each of a plurality of via holes formed in the resin insulating layers, a conformal via conductor is formed to electrically connect between the conductor layers. Filling up parts of the resin insulating layers layered at upper layer side inside of the conformal via conductor forms an anchor portion. The lower end side of the anchor portion bulges larger than the upper end side in the radially outward direction of the via hole.</p> |
