| 摘要 |
Provided is a film forming device capable of preventing reaction gas from being inserted into the back side of a substrate. The film forming device performs a film forming process by supplying the reaction gas regarding a substrate (W) inside a processing container. A loading stand (3) is formed to be able to ascend and descend between a processing position and a transfer position of the substrate (W). A surrounding member (inner ring (26)) surrounds the loading stand (3) of the processing position and divides the inner side of the processing container (2) into a space in which the reaction gas is processed, and a space of a lower side. A clamp ring (5) is loaded on the upper side of the surrounding member (26) when the loading stand (3) is located on the transfer position. When the loading stand (3) ascends to the processing position, an internal unit of the clamp ring (5) is in contact with a circumference surface unit of the substr. |
