发明名称 BALL JOINT
摘要 PROBLEM TO BE SOLVED: To provide a ball joint which inexpensively secures conductivity between a ball stud and a housing without affecting the slidability and the reliability.SOLUTION: A part of a conductor 51 which is electrically connected with a conductive housing 16 is disposed at a through hole 46 which communicates with a sliding surface 47 of an insulative ball seat 17. The conductor 51 is placed in pressure contact with a ball part 21 by a coil spring 52 disposed at a communication hole 34 of the housing 16. While the slidability of the ball part 21 is secured by the sliding surface 47 of the ball seat 17, conductivity is inexpensively secured between a ball stud 15 and the housing 16 by the conductor 51.
申请公布号 JP2014092193(A) 申请公布日期 2014.05.19
申请号 JP20120241730 申请日期 2012.11.01
申请人 SOMIC ISHIKAWA INC 发明人 MARUYAMA YASUYUKI
分类号 F16C11/06 主分类号 F16C11/06
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