RELEASE POLYIMIDE FILM AND METHOD FOR PRODUCING MULTILAYER PRINTED WIRING BOARD

摘要

PROBLEM TO BE SOLVED: To provide a release film which has excellent peelability from a product to be molded and a product to be laminated and heat-resistant strength and can obtain a product to be molded and a product to be laminated excellent in surface smoothness, and to provide a method for producing a multilayer printed wiring board using the same.SOLUTION: There is provided a method for producing a multilayer printed wiring board, the method comprising the steps of: forming a release polyimide film having a release layer on one surface of a polyimide film and a release layer on one surface of the polyimide film; forming an adhesive layer on a surface on which the polyimide film of the release layer is not provided to produce a release polyimide film having the adhesive layer; producing a multilayer printed wiring board by using the release polyimide film having the adhesive layer; and removing the release polyimide film from the multilayer printed wiring board.