发明名称 PLATING BATH AND PLATING METHOD USING THE SAME
摘要 PURPOSE: A plating bath and a plating method using the same are provided to prevent plating solution from coming in the adhesive surface of a substrate and from forming a plating layer since external and internal nozzles supply sound pressure to both the edge and the central part of the substrate. CONSTITUTION: A plating bath consists of a basket(100) and an adhesive board(110). The basket holds a substrate(120) and plating solution. The adhesive board is formed in the basket. One side of the substrate is adhered to the adhesive board. The adhesive board is formed in plural and in a hollow type. A suction hole(114) is formed on one side of the adhesive board. A suction nozzle(112) is formed on ones side, to which the substrate of the adhesive board is adhered.
申请公布号 KR20100132714(A) 申请公布日期 2010.12.20
申请号 KR20090051458 申请日期 2009.06.10
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 LEE, DONG GYU;CHOI, JIN WON;OH, HUENG JAE;MUN, SEON JAE;CHUNG, TAE JOON
分类号 C23C18/31 主分类号 C23C18/31
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