发明名称 ELECTRONIC COMPONENT ASSEMBLY
摘要 According to embodiments of the invention, an electronic component assembly may be provided. The electronic component assembly may include an electronic component body. The electronic component assembly may also include a non-conductive force transfer plate affixed to the electronic component body to receive an assembly force. The electronic component assembly may also include a plurality of electrical connectors passing through the non-conductive force transfer plate, wherein first ends of the electrical connectors are located within the electronic component body and second ends are located outside the electronic component body, and the electrical connectors have a force transfer structure adapted to engage the non-conductive force transfer plate and transfer at least a portion of the assembly force from the force transfer plate to the electrical connectors.
申请公布号 US2014133122(A1) 申请公布日期 2014.05.15
申请号 US201213677769 申请日期 2012.11.15
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 HOFFMEYER MARK K.;LEWIS THERON L.
分类号 H05K5/02;H05K3/32;H05K13/00 主分类号 H05K5/02
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