发明名称 LASER CUTTING APPARATUS AND LASER CUTTING METHOD
摘要 This laser cutting apparatus is a laser cutting apparatus that cuts a workpiece by radiating a laser beam thereon, and is provided with a laser entrance portion to which an optical fiber that transmits the laser beam is fixed and an optical system through which the laser beam radiated from the optical fiber fixed by the laser entrance portion passes, wherein the laser entrance portion includes a moving portion that moves or tilts the optical fiber with respect to the optical system and a fixing portion that fixes the moved or tilted optical fiber with respect to the optical system.
申请公布号 US2014131328(A1) 申请公布日期 2014.05.15
申请号 US201314048707 申请日期 2013.10.08
申请人 MITSUBISHI HEAVY INDUSTRIES, LTD. 发明人 WATANABE MASAO;KOGA TAIICHIROU
分类号 B23K26/38 主分类号 B23K26/38
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