| 摘要 |
The present invention relates to a manufacturing method of a printed electronic circuit board with a pillar part using a mask and the printed electronic circuit board thereby. The present invention comprises a mask setting process of positioning the mask with a through part on a substrate; a pillar part forming process of forming the pillar part on the substrate by injecting liquid resin through the through part of the mask; a mask removing process of removing the mask to allow only the pillar part to remain on the substrate; and a circuit part forming process of forming a conductive circuit part by injecting and hardening paste in which conductive fine particles are mixed in fluid resin with adhesiveness between the pillar parts of the substrate. |
