发明名称 SUSPENSION BOARD ASSEMBLY SHEET WITH CIRCUITS AND METHOD FOR MANUFACTURING THE SAME
摘要 A plurality of suspension boards and an inspection substrate are integrally supported by a support frame. In each suspension board, a line is formed on a conductive first support substrate via a first insulating layer. The first support substrate and the line are electrically connected by a first via in the first insulating layer. In the inspection substrate, a conductor layer is formed on a conductive second support substrate with a second insulating layer sandwiched therebetween. The second support substrate and the conductor layer are electrically connected by a second via in the second insulating layer. The first via and the second via have the same configuration.
申请公布号 US2014126169(A1) 申请公布日期 2014.05.08
申请号 US201314062264 申请日期 2013.10.24
申请人 NITTO DENKO CORPORATION 发明人 IHARA TERUKAZU;ISHII JUN;TERADA NAOHIRO
分类号 H05K7/02;H05K3/10 主分类号 H05K7/02
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