| 摘要 |
Disclosed is a mounting structure of a semiconductor package, said mounting structure being provided with a substrate (200) and a semiconductor package (100). An opening (210) connected to the hollow space of a waveguide (310) is formed in the substrate (200). The semiconductor package (100) is mounted on the substrate (200). The semiconductor package (100) is provided with a semiconductor device (110), and a probe (152) connected to the semiconductor device (110). The opening (210) is provided with a portion overlapping the probe (152), and a portion not overlapping the semiconductor package (100). |
