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发明名称
半导体装置之制造方法及基板处理装置
摘要
申请公布号
TWI436426
申请公布日期
2014.05.01
申请号
TW099139635
申请日期
2010.11.18
申请人
日立国际电气股份有限公司 日本
发明人
笹岛亮太;广濑义朗;太田阳介;赤江尚德;横泽光治郎
分类号
H01L21/316
主分类号
H01L21/316
代理机构
代理人
何金涂 台北市大安区敦化南路2段77号8楼;王彦评 台北市大安区敦化南路2段77号8楼
主权项
地址
日本
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