发明名称 |
RESIN COMPOSITION FOR LASER DIRECT STRUCTURING, RESIN MOLDED ARTICLE AND METHOD OF MANUFACTURING RESIN MOLDED ARTICLE HAVING PLATED LAYER |
摘要 |
PROBLEM TO BE SOLVED: To provide a resin composition excellent in plating properties.SOLUTION: A resin composition for laser direct structuring contains a glass filler coated by a sizing agent of 10 to 100 pts.wt. and a laser direct structuring additive of 2 to 20 pts.wt. based on 100 pts.wt. of a resin composition containing a polycarbonate resin of 30 to 100 wt.% and a styrenic resin of 70 wt.% or less, and the sizing agent contains at least one kind selected from a polyolefin resin and a silicone resin. |
申请公布号 |
JP2014074161(A) |
申请公布日期 |
2014.04.24 |
申请号 |
JP20130186944 |
申请日期 |
2013.09.10 |
申请人 |
MITSUBISHI ENGINEERING PLASTICS CORP |
发明人 |
MOGI ATSUSHI;MARUYAMA HIROYOSHI |
分类号 |
C08L69/00;B32B15/08;B32B15/20;C08K3/22;C08K9/04;C08L25/04 |
主分类号 |
C08L69/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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