发明名称 RESIN COMPOSITION FOR LASER DIRECT STRUCTURING, RESIN MOLDED ARTICLE AND METHOD OF MANUFACTURING RESIN MOLDED ARTICLE HAVING PLATED LAYER
摘要 PROBLEM TO BE SOLVED: To provide a resin composition excellent in plating properties.SOLUTION: A resin composition for laser direct structuring contains a glass filler coated by a sizing agent of 10 to 100 pts.wt. and a laser direct structuring additive of 2 to 20 pts.wt. based on 100 pts.wt. of a resin composition containing a polycarbonate resin of 30 to 100 wt.% and a styrenic resin of 70 wt.% or less, and the sizing agent contains at least one kind selected from a polyolefin resin and a silicone resin.
申请公布号 JP2014074161(A) 申请公布日期 2014.04.24
申请号 JP20130186944 申请日期 2013.09.10
申请人 MITSUBISHI ENGINEERING PLASTICS CORP 发明人 MOGI ATSUSHI;MARUYAMA HIROYOSHI
分类号 C08L69/00;B32B15/08;B32B15/20;C08K3/22;C08K9/04;C08L25/04 主分类号 C08L69/00
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