发明名称 MOS transistor, manufacturing method thereof, and semiconductor device
摘要 A MOS transistor has a first stress layer formed over a silicon substrate on a first side of a channel region defined by a gate electrode, and a second stress layer formed over the silicon substrate on a second side of the channel region, the first and second stress layers accumulating a tensile stress or a compressive stress depending on a conductivity type of the MOS transistor. The first stress layer has a first extending part rising upward from the silicon substrate near the channel region along a first sidewall of the gate electrode but separated from the first sidewall of the gate electrode, and the second stress layer has a second extending part rising upward from the silicon substrate near the channel region along a second sidewall of the gate electrode but separated from the second sidewall of the gate electrode.
申请公布号 US8703569(B2) 申请公布日期 2014.04.22
申请号 US201313761326 申请日期 2013.02.07
申请人 FUJITSU SEMICONDUCTOR LIMITED 发明人 PIDIN SERGEY
分类号 H01L21/336 主分类号 H01L21/336
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