发明名称 Cover of a package, a method for manufacturing the same and a package sealed with a cover and a method for sealing a package
摘要 A cardboard cover that seals a package and that also enables the resealing of the package. The lower surface of the cover (2) is provided with a downwards directed annular profile (3) made of an injection mouldable material, which enables the resealing of the cover and is placed inside the package when the package is sealed. The invention also relates to a package which is sealed by using the above-described cardboard cover that enables resealing. The invention also relates to a method for manufacturing a card-board cover and a method for sealing a package.
申请公布号 US8701922(B2) 申请公布日期 2014.04.22
申请号 US20070518844 申请日期 2007.12.05
申请人 MÄÄTTÄ PÄIVI;PENTTINEN TAPANI;TUOMINEN TOMMI;STORA ENSO OYJ 发明人 MÄÄTTÄ PÄIVI;PENTTINEN TAPANI;TUOMINEN TOMMI
分类号 B65D41/00 主分类号 B65D41/00
代理机构 代理人
主权项
地址