| 摘要 |
Disclosed herein is a circuit board that includes a resin substrate including a substrate wiring layer, and an electronic component embedded in the resin substrate and having a plurality of external electrodes. The resin substrate includes a plurality of via holes that expose the external electrodes and a plurality of via conductors embedded in the via holes to electrically connect the substrate wiring layer to the external electrodes. At least some of the via holes are different in planar shape from each other. |
