发明名称 HEAT DISSIPATING MODULE WITH ENHANCED HEAT DISSIPATION EFFICIENCY AND ELECTRONIC DEVICE THEREWITH
摘要 A heat dissipating module includes a main body, a heat dissipating unit and at least one resilient engaging unit. A side of the heat dissipating unit is connected to the main body and the other side of the heat dissipating unit contacts against at least one heat component. An end of the at least one resilient engaging unit is connected to a side of the main body and the other end of the at least one resilient engaging unit engages with a side of a fastening base. The at least one resilient engaging unit is for resiliently pressing the main body so that the dissipating unit contacts with the at least one heat component closely.
申请公布号 US2014098490(A1) 申请公布日期 2014.04.10
申请号 US201313944883 申请日期 2013.07.18
申请人 AOPEN INC. 发明人 YANG CHING-HUNG
分类号 G06F1/20 主分类号 G06F1/20
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