| 摘要 |
An element housing package according to one aspect of the invention includes a base body having a rectangular shape when seen in a plan view, having a mounting region for mounting a semiconductor element, a frame body disposed so as to surround the mounting region, a connection conductor disposed from the upper surface to a lower surface of the base body, a circuit conductor disposed on the lower surface of the base body, one end of the circuit conductor being electrically connected to the connection conductor and an other end of the circuit conductor being drawn out laterally from a first side surface of the base body, and a metal plate bonded to the lower surface of the base body, having an attachment region which is drawn out laterally from a second side surface adjacent to the first side surface of the base body to be attached to a mounting board, and a ground conductor region which is drawn out laterally from the first side surface of the base body so as to be parallel to the circuit conductor. The metal plate further has an outer peripheral region which is drawn out laterally from the base body, from the ground conductor region to the attachment region along an outer periphery of the base body when seen in a plan view. |
