发明名称 |
Light emitting device package and manufacturing method thereof |
摘要 |
There is provided a light emitting device package including: a substrate having a circuit pattern formed on at least one surface thereof and including an opening; a wavelength conversion layer formed by filling at least a portion of the opening with a wavelength conversion material; and at least one light emitting device disposed on a surface of the wavelength conversion layer and electrically connected to the circuit pattern. |
申请公布号 |
US8679872(B2) |
申请公布日期 |
2014.03.25 |
申请号 |
US201113312572 |
申请日期 |
2011.12.06 |
申请人 |
YOO CHEOL JUN;SONG YOUNG HEE;HWANG SEONG DEOK;LEE SANG HYUN;SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
YOO CHEOL JUN;SONG YOUNG HEE;HWANG SEONG DEOK;LEE SANG HYUN |
分类号 |
H01L21/00;H01L33/60 |
主分类号 |
H01L21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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