| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayer wiring board having high connection reliability, and to provide a probe card using the same.SOLUTION: A multilayer wiring board 1 includes a laminate 2, a connection pad 3, a through conductor 4, and a thin film conductor layer 5. The laminate 2 is laminating a plurality of resin insulation layers 2a. The connection pad 3 is provided on the upper surface of the laminate 2. The through conductor is provided from the uppermost resin insulation layer 2a in the thickness direction of the laminate. The thin film conductor layer 5 is provided between the layers of the plurality of resin insulation layers 2a, at a position overlapping the connection pad 3 in perspective plan view, and connected with the connection pad 3 via the through conductor 4. The through conductor 4 has a protrusion 6 formed by stretching a portion thereof in the thickness direction to the outside, between the connection pad 3 and the thin film conductor layer 5, and is formed integrally. |
