| 摘要 |
The present invention relates to a method for inspecting a sapphire wafer and, more particularly, to a method for inspecting a sapphire wafer, which can inspect the existence of surface defects such as scratches, particles, and cracks on the surface of a sapphire wafer by obtaining images with a scan camera by radiating light on the sapphire wafer from a laser device. The inspecting method comprises as follows: a step of obtaining images of the back surface of a sapphire wafer using an optical camera or a lighting device in a transferring process; a step of mounting the sapphire wafer in a rotation inspecting unit capable of moving along an X-, a Y-, and a Z-axis; a step of performing the incidence of the laser whose beam width and incidence angle can be regulated to the surface of the sapphire wafer; a step of obtaining an image signal from reflected light from the surface of the sapphire wafer using the optical camera whose converging angle can be regulated; a step of regulating the resolution of the obtained image by regulating the incidence angle or the beam width; and a step of rotating the rotation inspecting unit at a fixed angle. [Reference numerals] (P11) Transfer from a cartridge; (P12) Inspect the back surface in a transferring path; (P13) Mount a rotating module; (P14) Select the wavelength of laser beams and regulate the width; (P15) Regulate the inclination angle of the laser beams; (P16) Obtain an image; (P17) Regulate the displacement; (P18) Rotate the rotating module; (P19) Interpret the image |
