| 摘要 |
Provided are a printed wiring board and a manufacturing method thereof, which ensure the connection reliability of a bump and an increase in the density of a conductive pattern on the outermost layer. The printed wiring board includes: an interlayer dielectric layer (50F); a conductive pattern (58FP) on the interlayer dielectric layer (50F); and a solder resist layer which includes an opening part to expose part of the conductive pattern (58FP) at least and the interlayer dielectric layer (50F) around the conductive pattern (58FP). A metal layer is formed on the conductive pattern and the interlayer dielectric layer exposed through the opening part. A bump is formed in the opening part on the metal layer. |
