| 摘要 |
The present invention provides a lead-free glass for semiconductor encapsulation, which can encapsulate semiconductor devices at a low temperature and has an excellent acid durability, and an encapsulator for semiconductor encapsulation made of the glass. The glass comprises, as a glass composition, from 46 to 60% of SiO2, from 0 to 6% of Al2O3, from 13 to 30% of B2O3, from 0 to 10% of MgO, from 0 to 10% of CaO, from 0 to 20% of ZnO, from 9 to 25% of Li2O, from 0 to 15% of Na2O, from 0 to 7% of K2O, and from 0 to 8% of TiO2, in terms of % by mol, wherein a ratio by mol of Li2O to (Li2O+Na2O+K2O) is in the range from 0.48 to 1.00. |
