| 摘要 |
A module may be configured for connection with a microelectronic assembly having terminals and a microelectronic element. The module may include a circuit panel bearing conductors configured to carry command and address information, co-support contacts coupled to the conductors, and module contacts coupled to the conductors. The co-support contacts may include first contacts having address and command information assignments arranged according to a first predetermined arrangement for connection with a first type of microelectronic assembly in which the microelectronic element is configured to sample command and address information coupled thereto through the first contacts at a first sampling rate, and according to a second predetermined arrangement for connection with a second type of the microelectronic assembly in which the microelectronic element is configured to sample the command and address information coupled thereto through a subset of the first contacts at a second sampling rate greater than the first sampling rate. |
