发明名称 IMPROVEMENTS RELATING TO THE MOUNTING OF INTEGRATED CIRCUIT ASSEMBLIES
摘要 1,209,901. Mounting semiconductor devices. PLESSEY TELECOMMUNICATION RESEARCH Ltd. 8 Jan., 1968 [11 Jan., 1967], No. 1639/67. Headings H1K and H1R. An integrated circuit chip 1 is mounted on an insulating support 2 carrying a plurality of conductors 3 which extend over an aperture 6 in the support 2 to leave terminal ends 7 free for direct connection to the circuit chip 1. The conductors 3 are formed by etching metal foil on the insulating support. Apertures 8, 9 allow the conductors 3 to be bonded to printed wires of a printed circuit board (not shown). The chip 1, terminal ends 7 and conductors 3 may be encapsulated as shown by the chain outline.
申请公布号 GB1209901(A) 申请公布日期 1970.10.21
申请号 GB19670001639 申请日期 1967.01.11
申请人 BRITISH TELECOMMUNICATION RESEARCH LIMITED 发明人 LESLIE ALBERT DYER
分类号 H01L23/498 主分类号 H01L23/498
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