摘要 |
1,209,901. Mounting semiconductor devices. PLESSEY TELECOMMUNICATION RESEARCH Ltd. 8 Jan., 1968 [11 Jan., 1967], No. 1639/67. Headings H1K and H1R. An integrated circuit chip 1 is mounted on an insulating support 2 carrying a plurality of conductors 3 which extend over an aperture 6 in the support 2 to leave terminal ends 7 free for direct connection to the circuit chip 1. The conductors 3 are formed by etching metal foil on the insulating support. Apertures 8, 9 allow the conductors 3 to be bonded to printed wires of a printed circuit board (not shown). The chip 1, terminal ends 7 and conductors 3 may be encapsulated as shown by the chain outline. |