FLIP-CHIP, FACE-UP AND FACE-DOWN WIREBOND COMBINATION PACKAGE

摘要

A microelectronic assembly can include a substrate having an aperture extending between first and second surfaces thereof, the substrate having substrate contacts at the first surface and terminals at the second surface. The microelectronic assembly can include a first microelectronic element having a front surface facing the first surface, a second microelectronic element having a front surface facing the first microelectronic element, and leads electrically connecting the contacts of the second microelectronic element with the terminals. The second microelectronic element can have contacts exposed at the front surface thereof beyond an edge of the first microelectronic element. The first microelectronic element can be configured to regenerate at least some signals received by the microelectronic assembly at the terminals and to transmit said signals to the second microelectronic element. The second microelectronic element can embody a greater number of active devices to provide memory storage array function than any other function.