发明名称 COMPOSITE SENSOR AND COMPOSITE SENSOR MODULE
摘要 PROBLEM TO BE SOLVED: To provide a composite sensor which can sufficiently increase the sensitivity of sensors, while ensuring the degree of flexibility in manufacturing and layout.SOLUTION: A composite sensor 11 is configured such that an arrangement area R1 for thermal image sensors 16 and an arrangement area R2 for distance image sensors 31 are provided to overlap each other when viewed from a stacking direction. This allows a thermal image and a distance image to be obtained as images on the same axis, thus suppressing image displacement between the thermal image and the distance image. Further, in the composite sensor 11, a sealed body S1 formed by stacking a first substrate 13 and a second substrate 14 allows a space in the surroundings of the thermal image sensors 16 to be sealed under vacuum. This prevents heat generated in the surroundings of the distance image sensors 31 from affecting the thermal image sensors 16. In addition, the substrate on which the thermal image sensors 16 are arranged and the substrate on which the distance image sensors 31 are arranged are provided separately. This ensures the degree of design flexibility.
申请公布号 JP2014032045(A) 申请公布日期 2014.02.20
申请号 JP20120171340 申请日期 2012.08.01
申请人 HAMAMATSU PHOTONICS KK 发明人 OSHIMA FUMIKAZU;MASE MITSUTO;SAKURAI NAOTO
分类号 G01V8/20;G01B11/00;G01J1/02;H01L27/146;H04N5/33;H04N5/335 主分类号 G01V8/20
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