| 摘要 |
The present invention relates to an alignment recognition device for laminating semiconductor chips and a forming method thereof and more specifically, to an alignment recognition device for laminating semiconductor chips and a forming method thereof which are capable of correctly recognizing an attachment location when an upper chip is laminated on a lower chip by forming a dummy type alignment recognition member in the lower chip. That is, the present invention is to provide the alignment recognition device for laminating semiconductor chips and the forming method thereof which are capable of correctly performing the alignment of the upper chip relative to the lower chip by forming more dummy penetration silicon via and exposing them without nickel/gold plating when a plurality of penetration silicon via is formed in the lower chip and by recognizing a dummy through silicon via as a reference mark for the alignment in an optical camera when the upper chip is laminated on the lower chip. [Reference numerals] (AA) Alignment of a conductive bump and the center of a penetration silicon via |
