| 摘要 |
In a vacuum processing apparatus including a plurality of vacuum transfer vessels arranged back and forth at the back of a lock chamber, an intermediate chamber arranged between them and capable of accommodating wafers, and processing units connected to respective vacuum transfer vessels, a wafer processed in a pre-processing vessel out of the processing units connected to the respective vacuum transfer vessels is transferred to a post-processing vessel connected to the same vacuum transfer vessel and post-processing is performed. |
