METHODS FOR MECHANICALLY FORMING CRACK INITIATION DEFECTS IN THIN GLASS SUBSTRATES

摘要

Methods for mechanically forming crack initiation defects in thin glass substrates are described. In one embodiment, a method for separating a glass substrate into a plurality of substrates includes directing a flow of carrier fluid having abrasive material entrained therein onto the surface of the glass substrate to form an initiation defect in the surface of the glass substrate. The initiation defect does not extend through a thickness of the glass substrate. Thereafter, the initiation defect is heated with a laser source and subsequently cooled with a cooling fluid such that a crack initiates from the initiation defect. The crack extends through the thickness of the glass substrate and propagates across the glass substrate such that the glass substrate is separated into a plurality of substrates.