PRINTHEAD INCLUDING INTEGRATED CIRCUIT DIE COOLING
摘要
One example provides a printhead including a substrate and a fluidics structure attached to the substrate. The fluidics structure includes actuators for ejecting ink from the printhead. The printhead includes an integrated circuit die attached to the substrate. The integrated circuit die is for driving the actuators. The integrated circuit die is cooled by a coolant contacting the integrated circuit die and flowing through the substrate.
申请公布号
WO2014021812(A1)
申请公布日期
2014.02.06
申请号
WO2012US48783
申请日期
2012.07.30
申请人
HEWLETT-PACKARD DEVELOPMENT COMPANY L.P.;CRUZ-URIBE, TONY S.;CLARK, JAMES EDWARD