LIGHT-EMITTING DEVICE, MANUFACTURING METHOD THEREOF, MOLDED BODY AND SEALING MEMBER

摘要

PROBLEM TO BE SOLVED: To provide a light-emitting device employing a molded body which has excellent heat resistance and light resistance, and a manufacturing method thereof and to provide the molded body for the light-emitting device and a sealing member for the light-emitting device.SOLUTION: The light-emitting device comprises: a light-emitting element of a gallium-nitride based compound semiconductor having a light emission peak wavelength in 430 nm or more; and a molded body using a hardened material of a thermosetting epoxy resin composition on which the light-emitting element is placed. The thermosetting epoxy resin composition contains a ground product of a solid containing a specific high molecular weight component, a middle molecular weight component and a monomer component in a reaction product obtained by reacting (A) triazine derivative epoxy resin and (B) acid anhydride in a ratio of epoxy group equivalent amount/acid anhydride group equivalent amount being 0.6 to 2.0 under the presence of (C) triphenyl phosphite and/or 2,6-di-t-butyl-p-cresol. The light-emitting device has excellent heat resistance, light resistance and adhesion.