发明名称 |
LIGHT-EMITTING DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME |
摘要 |
Disclosed is a light emitting device package. The light emitting device package includes a semiconductor substrate comprising a first surface at a first depth from an upper surface of the semiconductor substrate and a second surface at a second depth from the first surface; and a light emitting part on the second surface of the semiconductor substrate. |
申请公布号 |
EP2299503(A4) |
申请公布日期 |
2014.02.05 |
申请号 |
EP20090750713 |
申请日期 |
2009.04.01 |
申请人 |
LG INNOTEK CO., LTD. |
发明人 |
WON, YU HO;KIM, GEUN HO |
分类号 |
H01L33/48;H01L33/50;H01L33/60;H01L33/62 |
主分类号 |
H01L33/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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