ADHESIVE COMPOSITION FOR SEMICONDUCTOR DEVICE, ADHESIVE FILM FOR SEMICONDUCTOR DEVICE, ADHESIVE FILM WITH DICING FILM, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide: an adhesive composition for a semiconductor device, with which a semiconductor device less in voids and high in reliability can be manufactured; an adhesive film for a semiconductor device; and an adhesive film with a dicing film.SOLUTION: An adhesive composition for a semiconductor device has a loss tangent (tan δ) of 0.2-0.6 at 175°C in a dynamic viscoelasticity measurement after heated at 175°C for one hour.