| 摘要 |
PROBLEM TO BE SOLVED: To provide a technology to enable appropriate detection of an alignment mark by preventing entry itself of air bubbles near the alignment mark.SOLUTION: A semiconductor device manufacturing method disclosed in the present embodiment comprises a film formation process, an alignment mark formation process and a sheet member attachment process. In the film formation process, a film is formed at least on a part of one surface of a semiconductor wafer 2. In the alignment mark formation process, an alignment mark 6 is formed by formation of a recess in the film formed. In the sheet member attachment process, a sheet member is attached to the one surface of the semiconductor wafer on which the alignment mark 6 is formed. |
