发明名称 Method For Debonding Items With Reactive Multilayer Foil
摘要 An apparatus comprising a first substrate, a second substrate, a bonding layer positioned between the first substrate and the second substrate, the bonding layer holding the first substrate and the second substrate together, and a reactive layer embedded in the bonding layer. The reactive layer can generate sufficient thermal energy to cause the first substrate to separate from the second substrate without damaging at least one of the first substrate or the second substrate when the reactive layer is activated, and is preferably comprised of a reactive multilayer foil.
申请公布号 US2014020845(A1) 申请公布日期 2014.01.23
申请号 US201313946991 申请日期 2013.07.19
申请人 THERMAL CONDUCTIVE BONDING, INC. 发明人 SCATENA RYAN A.;STACK ANDREW P.;SIMPSON JOSEPH A.
分类号 B32B7/10 主分类号 B32B7/10
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