NICKEL-TUNGSTEN PLATING SOLUTION AND NICKEL-TUNGSTEN PLATING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a nickel-tungsten plating solution capable of stable plating while suppressing the change in the plating solution during plating, and a nickel-tungsten plating method using the plating solution.SOLUTION: A nickel-tungsten plating solution comprises: a nickel-containing substance; a tungsten-containing substance; and an additive. The additive includes: at least one selected from the group consisting of sulfobenzoic acid imide and a salt of sulfobenzoic acid imide; and at least one selected from the group consisting of the decomposed matter of sulfobenzoic acid imide and the decomposed matter of a salt of sulfobenzoic acid imide. A nickel-tungsten plating method is characterized in that a nickel-tungsten plating film is formed on a substrate using the nickel-tungsten plating solution.